System and means for dynamic micro-positioning and alignment of media

ABSTRACT

A self-contained means to move a media or component, such as fiber ( 12 ) or other miniature object, such as a lens, into a desired position is given. The fiber ( 12 ) or component is moved in various dimensions to achieve the desired location and is locked into position after the move. An input electrical signal, such as a voltage or current controls movement. A thermal actuator comprises the micro-positioner ( 80 ) using semiconductor technology in one embodiment. In another embodiment, of the present invention, a thermal or electrostatic actuator uses mechanical gears to move the fiber. Another embodiment of the present invention is implemented using mechanical technology such as microelectromechanical system (MEMS) technology. Another embodiment of the present invention, utilizes piezoelectric materials to facilitate fiber movement.

CROSS REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.10/683,626, entitled “DYNAMIC MICRO-POSITIONER AND ALIGNER”, filed Oct.10, 2003, which is related to U.S. provisional patent application No.60/424,741, filed Nov. 8, 2002, entitled 1N SITU DYNAMIC FIBER ALIGNER.The entire contents of both applications are incorporated herein by thisreference. The Applicants hereby claim the benefits of this earlierpending patent application and its related provisional application under35 U.S.C. Section 19(e).

TECHNICAL FIELD

The present invention relates to one or a plurality of micro-positionersused to dynamically align, position or move media(s), mass(es), orcomponent(s) and device(s) related thereto. Such media include, but arenot limited to, one or a plurality of fibers, optical fibers, opticalelements, tubes or wires, and such components include, but are notlimited to, lenses, nozzles, valves, antenna elements and radiofrequency (“rf”) stubs. The micro-positioners can be positioned andsecured inside a jacket or other self-contained housing adapted toreceive and hold the media or securely hold the components. Themicro-positioners may also be used to position materials within anintegrated package, such as an optical package.

DESCRIPTION OF CONVENTIONAL ART

The conventional means of aligning a media or component is to staticallyalign the media or component or the mount holding the media or componenteither passively or actively. Static or statically, refers to theinability to make adjustments to the media after the media and relatedelements are anchored. To align a media passively, small siliconworkbenches are etched into a device using semiconductor technology.Piece parts are then placed upon the etched workbench and secured inplace. In the foregoing case, the media could consist of optical fiber.The passive method requires that the optical fiber be precisely locatedand aligned to a mechanical feature, which can in turn be located in anetched groove within the workbench. The passive method has had limitedalignment success because, in many cases, the relationship between themechanical feature and the optical fiber is not sufficiently precise.Disadvantageously, no adjustment of the optical fiber is possible afterplacement and anchoring to the final location. The same considerationsapply to media other than optical fiber.

Because of the cited disadvantageous of the passive method, the activemethod of aligning a media or component is more widely used. The activemethod uses complex equipment to move a media, typically an opticalfiber, into alignment. The equipment then anchors the media, such as anoptical fiber, using glue, solder or welding. While the active method ismore precise, successful employment of the active method requirescomplex equipment and precise piece parts with extremely flat and smoothsurfaces. Disadvantageously, manufacturing yields using the activemethod are typically low and rework of the assemblies is difficult. Asin the case of passive alignment, active alignment is static. Thepresent invention comprises a dynamic micro-positioner used to positionand/or align media or components and includes a variety of embodimentsand applications thereof. The present invention can be used to positionand/or align a media or components, such media including, but notlimited to, one or a plurality of fibers, optical fibers, opticalelements, tubes or wires, such components including, but not limited to,lenses and/or nozzles.

With reference to the conventional art, there are disclosed variousconventional active and passive means of and apparatus for aligningmedia and components, typically optical elements and optical assemblies.The MEMS actuator disclosed in U.S. Pat. No. 6,114,794 to Dhuler et al.,uses a silicon substrate upon which a bimetallic material is added. Themethod of fabricating the actuator of Dhuler applies a separate heaterto expand the bimetallic member. Disadvantageously, the member of Dhuleris securely attached to the substrate such that only a minimum amount ofdisplacement can be achieved. Dhuler further discloses a latchmechanism. However the latch is operable only to lock the opticalelement in a few discrete positions. In contrast to Dhuler, anembodiment of the present invention includes integral heaters to provideexpansion and a locking mechanism to allow for a continuum of possiblelocked positions. Further, the mechanism of an embodiment of the presentinvention transitions through a sequence of alternating lockingpositions. This permits large movements, the integrated heatersproviding a user defined step size.

The apparatus and method of optical switching disclosed in U.S. Pat. No.6,381,382 B2 to Goodman et al., adds a composition on the sides of afiber, longitudinally, which contracts or expands with an electricalsignal. The invention of Goodman et al., is operable to bend fiber andthus align optics. Disadvantageously, the invention of Goodman et al.,requires continuous electrical power to maintain alignment and usespiezoelectric and other materials. Because of local stresses on thefiber, polarization properties of the light signal may be affected. Anembodiment of the present invention has integral micro-positioners tomove media, such as optical elements, to a desired location. The presentinvention does not utilize longitudinal actuators attached to fiber, butrather uses a MEMS thermal actuator perpendicular to the fiber.

The mounting and alignment structure disclosed in U.S. Pat. No.6,487,355 to Flanders discloses a passive alignment and static anchoringstructure fine-tuned by flexion. The invention of Flanders does notpermit dynamic anchoring. In contrast, the present invention permitsactive alignment of a media without flexion and permits dynamicanchoring of the media.

The fiber optic switching system and method disclosed in U.S. Pat. No.4,696,062 to LaBudde consists of an optical switch that moves a lensrelative to a fixed optical rod between ports to produce a switchwherein alignment is achieved by monitoring a reflection. In contrast,the fiber optic embodiment of the present invention uses free spacebetween two collimators or combination of collimator and fiber.

The lens assembly disclosed in U.S. Pat. No. 6,374,012 B1 to Bergmann etal., utilizes a lens within the optical path which, when movedperpendicular to the optical path, causes a change in its pointingangle. The assembly requires external manipulators to move parts totheir desired location and incorporates welding, adhesives, or solder toanchor the assembly into position. After anchoring, the elements cannotbe further adjusted. In contrast, an embodiment of the present inventionutilizes integral micro-positioners to move the elements, such asoptical elements, into a desired location. The assembly of the presentinvention is self-locking in that when power is not supplied, theelements are anchored. Further, the present invention is dynamic in thatat any point within the life of the product, power may be applied tomove the media, such as a fiber or optical element, to a new setting.

The piezoelectric apparatus disclosed in U.S. Pat. No. 4,512,036 to Laoruses a piezoelectric component to bend a fiber thus aligning it. Withthe invention of Laor, if deformation occurs, then the anchoring isstatic. If not, then voltage must be maintained to secure alignment. Theuse of piezoelectric, disadvantageously, requires application andmaintenance of high voltages to the piezoelectric element. An embodimentof the present invention uses integral micro-positioners to move media,such as optical fiber or optical components, into a desired location.Further, an embodiment of the present invention is self-locking suchthat when power is not supplied, the media, such as optical fiber oroptical components, remain anchored.

The assembly disclosed in U.S. patent application Ser. No. 09/733,049 byMusk uses silicon machined mechanical parts as a means to locate andmove optical elements relative to each other. The assembly requiresexternal manipulators to move parts to a desired location andincorporates welding, adhesives, or glass re-flow to anchor the opticalelements into position. Disadvantageously, anchoring is static in thatafter anchoring the alignment, media or elements cannot receiveadditional adjustment. An embodiment of the present invention hasintegral micro-positioners to move the media, such as optical fiber oroptical elements, into a desired location. Further, themicro-positioners are self-locking. When power is not supplied to thepresent invention, the media, such as optical fiber or optical elements,are anchored, yet the present invention remains dynamic in that at anypoint during the life of the product, power may be applied to move themedia to a new setting.

The method disclosed in U.S. Pat. No. 6,205,266 to Palen uses lightcoupled from the signal path to provide feedback allowing continuousadjustment of a fiber. This method is referred to as active alignment.The invention of Palen requires continuous power to maintain theposition of the optical element. In contrast, an embodiment of thepresent invention allows periodic alignment, anchoring, and realignment,without the need for continuous power to the micro-positioner. Further,while the invention of Palen covers continuous alignment using opticalfeedback architecture, it does not include an anchoring mechanism, asdoes the present invention.

The apparatus disclosed in U.S. patent application Ser. No. 10/098,742by Deck et al., applies interferometric methods to actively align andstatically anchor optics using external manipulators. In contrast, anembodiment of the present invention uses internal micro-positioners,dynamic anchoring, and remains transparent to the method used to detectalignment errors.

None of the following references disclose a method and apparatus fordynamically aligning a media using integral micro-positioners thatpermit movement of a media, such as an optical fiber or optical element,into a desired location, the micro-positioner assembly being selflocking. Further, none of the following disclosed references remaindynamic such that, at any point during the life of the product, powermay be applied to implement a new desired setting, such alignment beingpossible in the field. For example, the method and apparatus disclosedin U.S. Pat. No. 6,244,755 B1 to Joyce et al., utilizes active alignmentand static, not dynamic, anchoring using external manipulators and ametal bracket that is deformed to achieve alignment. The opticalinterface disclosed in U.S. Pat. No. 6,477,303 to Witherspoon usesV-groove technology to achieve passive alignment and static anchoring tofacilitate optical backplanes. The invention of Witherspoon is focusedon the optical interface between a circuit board and a main-board usingmicro-machining techniques to chemically etch paths in the substrate tofacilitate self-alignment. The method and apparatus for aligning opticalcomponents disclosed in U.S. Pat. No. 6,480,651 B 1, to Rabinski usestwo stages. One stage is used to align the fiber and the second stage isused to adjust, maintain and lock the optical components about a virtualpivot point. The invention of Rabinski is used to align fiber arrayssimilar to that used in V-groove technology. The apparatus disclosed inU.S. Pat. No. 6,240,119 to Ventrudo uses a partial reflector and fibergrating in series with an optical beam to stabilize laser performance.The kinematic mount disclosed in U.S. Pat. No. 5,748,827 to Holl et al.,consists of a passive alignment method using a two stage mountablemodule with a macro-stage and a micro-stage that further includes afluid flow control channel. The coupling elements disclosed in U.S. Pat.No. 4,452,506 to Reeve et al., consists of an alignment algorithm andmethod of using light in a fiber buffer to determine the direction ofmovement of a fiber needed to achieve alignment. The electrostaticmicro-actuator disclosed in U.S. Pat. No. 5,214,727 to Carr et al., usesan electrostatic actuator for moving a fiber in a switch application.The actuator is specifically designed in an H-shape. The method of Carret al., restricts the size of motion and requires large enablingvoltages. In contrast, an embodiment of the present invention uses athermal expansion bar, which provides for both large and small step sizemovements at low voltages. The alignment apparatus disclosed in U.S.Pat. No. 4,474,423 also uses light in a buffer glass to align fibers foruse, for example, in splicing applications. The polarization statechanger and phase shifter disclosed in U.S. patent application Ser. No.10/150,060 by MacDonald utilizes a method whereby stress is applied to awave-guide to shift phase or modify the polarization state. The methodand system for attenuating power in an optical signal disclosed in U.S.patent application Ser. No. 09/796,267 by Cao et al., utilizes MEMSmirrors in a variable optical attenuator. The structures disclosed inU.S. patent application Ser. No. 10/072,629 by Hsu et al., provides ameans of compensating for thermal effects and stress through flexiblesymmetry. The apparatus and method disclosed in U.S. patent applicationSer. No. 09/775,867 by Miracky uses an electrostatic actuator that movesa lens-using comb drive for the actuator for optical lens movement.

In “Surface Micro-machined 2D Lens Scanner Array”, Proc. IEEE/LEOSOptical Mems., by H. Toshiyoshi, G. D. J. Su, J. LaCosse, and M. C. Wu(“Toshiyoshi”), an apparatus that uses a stepping motion to move a lensinto alignment with another optical device is described.Disadvantageously, the apparatus of Toshiyoshi requires significantvoltage to move a comb with etched steps in micrometer step increments.An embodiment of the present invention uses integral micro-positionersto move the optical components to a desired location using a thermalexpansion bar. The micro-positioner of the present invention can movemedia, or components, in very small or large steps and can lock themedia or component into position when power is not applied. The presentinvention overcomes the disadvantages of the passive and activealignment methods by providing an inexpensive, dynamic means to alignmedia, such as optical fibers or optical elements, or components. Thepresent invention permits adjustment and alignment of the media orcomponents during subsequent assembly steps and after deployment withina network or apparatus.

The apparatus disclosed in U.S. patent application Ser. No. 3,902,084 byMay discloses a piezoelectric inchworm motor that provides precisionmotion in one direction. The device does not provide two-dimensionalmotion, as does the present invention, and is designed to move acylindrical shaft parallel to piezoelectric actuators. Such aconfiguration is not suitable in size or orientation to perform thefunction of an in situ dynamic aligner. In contrast, an embodiment ofthe present invention uses internal micro-positioners with dynamicanchoring configured for in-situ applications requiring control in aplurality of dimensions.

The apparatus disclosed in United States Patent Application SerialNumber 6380661 by David A. Henderson, also defines a piezoelectricinchworm motor with one dimension operation. The invention usesinterdigitated ridges made using MEMS technology and alternatingclamping to make linear movements. To maintain a load electrical powermust be applied. The present invention permits movements in a pluralityof dimensions, does not require power when holding a load, and providesa small configuration compatible with in-situ applications.

BRIEF DESCRIPTION OF THE INVENTION

The use of fiber optics in telecommunication applications requires thealignment of various optical elements to extremely low tolerances in therange of 0.1 micron. These low tolerances have not previously beenencountered in commercial manufacturing. Achieving such low tolerancesin alignment of optical fibers and related components requires costlyequipment and long manufacturing cycles of optical components. Anembodiment of the present invention comprises a component that canachieve low alignment tolerances, while accomplishing opticalinput/output (“I/O”) objectives. Further, an embodiment of the presentinvention satisfies a need to dynamically control and tune opticalpower.

Critically low tolerances are required between optical fiber lenses orother optical elements such as planer components. These low tolerancesare difficult to achieve in volume manufacturing. An embodiment andapplication of the present invention which comprises an optical alignerand collimator provides a dynamic means to achieve precise, lowalignment tolerances and further provides a means to power tune anoptical fiber during the life of the component. One embodiment of thepresent invention comprises a micro-positioner to align and manipulatean optical fiber, the entire assembly adapted to be positioned in aself-contained housing or in an integrated assembly. Depending on theapplication, a lens and/or jacket, including a hermetic jacket, may beincluded as part of the self-contained housing. Lenses can be used onthe end of the self-contained housing when an application requires beamconditioning. A metal jacket, case, or package can further be used, asnecessary to encapsulate the device, facilitate mounting, and/or providehermetic sealing.

In one embodiment of the present invention, a micro-positioner moves amedia or component, such media including, but not limited to, one or aplurality of fibers, optical fibers, optical elements, tubes or wires,such components including, but not limited to, lenses or nozzles media,in one dimension. In another embodiment of the present invention, amicro-positioner moves a media or component, such media including, butnot limited to, one or a plurality of fibers, optical fibers, opticalelements, tubes or wires, such components including, but not limited to,lenses or nozzles media, in at least two dimensions in the plane of themicro-positioner.

An application of the one-dimensional or two-dimensional embodiment ofthe present invention is as a dynamic collimator. Another application ofthe one-dimensional or two-dimensional embodiment of the presentinvention is as a dynamic fiber aligner. A dynamic fiber aligner issimilar to a dynamic collimator but the dynamic fiber aligner does notemploy a collimating lens. In either of the foregoing applications ofthe present invention, a dynamic collimator or dynamic fiber aligner isattached to an optical component package by soldering, welding, epoxy orother means. Unlike with conventional collimators or fiber aligningmethods, attachment tolerances of the present invention are lesscritical since the micro-positioner of the present invention is dynamicand may be adjusted electronically to achieve the desired alignment.Active adjustment of the media or component in the present invention isaccomplished by applying electrical signals or pulses comprising currentthrough, or a voltage across, micro-positioner arms in certain controlsequences to define the direction and distance of the motion of theoptic fiber or other media in one or two dimensions. The amplitude orduration of the electrical signals, or pulses, can be used to define thedistance traveled. When a signal is not applied, the micro-positioner islocked into position to ensure anchoring at the desired location. Anembodiment of the micro-positioner of the present invention isconstructed using semiconductor technology. This micro-positioner takesadvantage of the measurable thermal expansion characteristics of itsexpansion bars to cause movement, and hence, positioning and/oralignment, of the media or components. Each expanding, or contracting,expansion bar(s), has a set of corresponding clamps on the ends thereof,and the operation thereof creates a precision stepping motion. At leastone expansion bar is required for each degree of freedom desired. Sincepower dissipated in an expansion bar is proportional to the square ofvoltage applied, and since thermal expansion is linearly dependent uponpower dissipation, expansion or step size is proportional to the squareof applied voltage. Thus, the invention has the ability to make largesteps, in micrometers, and small steps, in nanometers.

Several embodiments of the present invention disclosed herein disclosethe use of semiconductors to implement the expansion bars, however, theuse of thermal expansion bars can be realized using small mechanicalparts assembled without using semiconductor technologies. Themicro-positioner of the present invention can be implemented usingmicroelectromechanical systems (“MEMS”) technology, where in themicro-positioner, the expansion bar is replaced with silicon etchedgears and/or racks. Alternatively, the present invention can beimplemented with piezoelectric or other material that expands withapplication of electrical current or voltage to effect movement.

BRIEF DESCRIPTION OF THE FIGURES

FIG. 1 illustrates schematically a cross-section of a single channeldynamic collimator wherein the micro-positioner moves an optical fiber.

FIG. 2 illustrates schematically a cross-section of a single channeldynamic collimator wherein the micro-positioner moves the lens.

FIG. 3(a) illustrates a side view of a multiple channel dynamicaligner/collimator with N×M channels wherein micro-positioners of thepresent invention adjust and/or align optical fibers independently.

FIG. 3(b) illustrates a front view of the N×M array of FIG. 3(a).

FIG. 4 illustrates schematically a cross-section of a multiple channeldynamic collimator/aligner with N channels in one direction and M in theother wherein the micro-positioner moves the lenses independently.

FIG. 5 illustrates the concept of electrical operation of a onedimensional micro-positioner expansion bar.

FIG. 6 illustrates a pulse train showing typical control signals to themicro-positioner expansion bar for right movement.

FIG. 7 illustrates a pulse train showing typical control signals to themicro-positioner expansion bar for left movement.

FIG. 8(a) is a top view of a first embodiment of the micro-positionerassembly of the present invention.

FIG. 8(b) is an exploded view of a spring, clamp, expansion barsubassembly of the first embodiment of the micro-positioner of thepresent invention.

FIG. 9 is a schematic of the electrical operation of a two-dimensionalmicro-positioner of the present invention.

FIG. 10 is a top view of a MEMS-based stepping and clamping mechanismfor the X-translation stage of a micro-positioner of the presentinvention.

FIG. 11 is a top view of a MEMS-based stepping and clamping mechanismfor the Y-translation stage of a micro-positioner of the presentinvention.

FIG. 12 is a top view of the integrated stepping and clamping mechanismfor the X-Y precision translation stages of a micro-positioner of thepresent invention.

FIG. 13 is a side view of an integrated stepping and clamping mechanismfor the X-Y precision translation stages of a micro-positioner of thepresent invention.

FIG. 14 is a top view of a second embodiment of a micro-positioner ofthe present invention, specifically, a MEMS based mechanism that usesstep and clamp motion and slide retainers.

FIG. 15 illustrates the use of a pair of micro-positioners of thepresent invention in self-contained housings used to align opticalfibers.

FIG. 16 is a schematic diagram that illustrates the electrical operationof a two dimensional micro-positioner expansion bar.

FIG. 17 is a logic diagram of the electrical schematic of FIG. 15.

FIGS. 18 and 19 set forth performance and maximum fiber forcecalculation for an optical fiber embodiment of the present invention.

FIG. 20 is a graph illustrating range of control, performance as avariable optical attenuator (“VOA”) as a function of fiber displacement.

FIG. 21(a) is a side view of a lens illustrating a light ray angles froman optical fiber.

FIG. 21(b) is a graph illustrating optical control and collimatorperformance as a function of fiber displacement.

FIGS. 22(a) and 22(b) are graphs illustrating constraints on performanceof fiber optics.

FIG. 23 is a top view of a further embodiment of the micro-positioner ofthe present invention shown in one dimension only.

FIG. 24 comprises a top view of an embodiment of the micro-positioner ofthe present invention designed for x-y motion, said FIG. 24 beingprovided in subparts (a) and (b) so as to more clearly delineate thereference numerals.

FIG. 25 comprises a top view of another embodiment of themicro-positioner of the present invention, said FIG. 25 being providedin subparts (a), (b) and (c) so as to more clearly delineate thereference numerals.

DETAILED DESCRIPTION OF THE INVENTION

An advantage of the present invention is that each media or component,such as an optical fiber or lens, is independently adjustable. When usedwith optical fiber, the present invention is operable to permitindependent optimization of the throughput light. The jacket or otherouter housing of the present invention can be constructed usingconventional microelectronic and optical packaging technology andstandard sizes. The embodiment of the present invention used withoptical fiber can be enclosed such that the fiber guide andmicro-positioner are positioned in a jacket. Control, or electricalleads pass through apertures in the jacket or housing so that themicro-positioner therein may be adjusted electrically.

Embodiments of the present invention used in optical fiber applicationsmay also utilize a lens or lens assembly. Lenses are used when beamconditioning of the light is desired. Such embodiments of the presentinvention may be enclosed in jackets or housings. In each optical fiberembodiment, a micro-positioner that adjusts the fiber or other media orlens in at least one dimension is required. In optical applications,critical tolerances are required between the optical fiber and lens or,as in the case where lenses are not required, between the optical fiberand other optical elements such as planar components. Optical fibers andfiber guide are enclosed within the jacket or housing using adhesives orother suitable attachment means. The optical fiber embodiments of thepresent invention can be constructed such that the optical fiber orother media is stationary and the component, such as the lens, isadjusted by the micro-positioner. In such case, the fiber does not passthrough the micro-positioner, but the component, such as the lens, ismounted on the micro-positioner. The appearance and size of the jacketor housing enclosing the present invention are similar to collimatorsconventionally available, although, as noted, the present invention hascontrol or electrical leads extending through the jacket or housing.

The micro-positioner is a multi-dimensional device, which, whenelectrically activated, moves the media or component in steps ofvariable step size from a few micrometers to a few nanometers in thedesired direction. In an embodiment of the present invention, an exposedend of the optical fiber is threaded through a movable mount located ona shuttle subassembly of the micro-positioner. As the movable mountmoves in an X-Y direction, the exposed end of the optical fiber bends.The optical fiber sheath proximate to the exposed end of the opticalfiber is firmly attached to a fiber guide within the jacket or housing.Distances between the micro-positioner and fiber guide are very large ascompared to the micro-positioner movement so that the change in opticalfiber to lens distance is not significant and micro-bending losses arenot of concern. In operation, a computer algorithm is used to computeand send control signals to the micro-positioner to achieve the desiredpositioning and/or alignment of the optical fiber. For purposes of thisapplication and the claims herein, reference to movement in the X-Ydirection shall be deemed to include movement measured in a polarcoordinate system, such as (r, theta) e.g., radius from an origin, anddegrees of rotation from an axis.

The optical fiber embodiment of the present invention is operable todefine a collimating light path. Advantageously, the present inventionadds no optical elements through which the light must traverse. As such,there is no impact upon optical dispersion or polarization.Implementation of the micro-positioner requires no additional surfacearea or volume within a conventional collimator package. The deviceenclosing the micro-positioner appears as a collimator with leads.Employment of the present invention only requires replacement of aconventional collimator or fiber anchor apparatus.

FIG. 1 illustrates a single channel dynamic collimator 10 embodiment andapplication of the present invention. As seen therein, the deviceconsists of a conventional buffered fiber that has been stripped of thebuffer 11 exposing the optical fiber 12. The buffered fiber 11 andoptical fiber 12 are inserted into fiber guide 13 that aligns the bareoptical fiber 12 so it may be inserted into the movable mount ofmicro-positioner 14. The micro-positioner 14 is operable to move theoptical fiber 12 with precision in two dimensions, Y, which isvertically, and X, which is in and out of the plane of the paper, andlock the optical fiber 12 in place after movement. The buffered fiber11, optical fiber 12, and fiber guide 13 are securely fastened eithermechanically, with epoxy, or with other adhesives into the collimatorjacket 17 to provide strain relief. A collimating lens 15, as isrequired for optical properties, is attached using a hermetic materialsuch as solder and electrical leads 16 are passed through the jacket 17to permit control or electrical connections to the micro-positioner 14.

FIG. 2 also illustrates a single channel dynamic collimator 20embodiment and application of the present invention, however, theoptical fiber 22 is held stationary and the lens 25 is mounted to themicro-positioner 24 to permit positioning and/or alignment. As seentherein, the device consists of a conventional buffered fiber 21 thathas been stripped of the buffer exposing the optical fiber 22. Theoptical fiber 22 is inserted into a fiber guide 23 that aligns the bareoptical fiber 22. The micro-positioner 24 moves the lens 25 withprecision in two dimensions, Y, which is vertically, and X, which is inand out of the plane of the paper, and locks the lens 25 in place aftermovement. The buffered fiber 21, optical fiber 22, and fiber guide 23are securely fastened either mechanically, with epoxy, or with otheradhesives into the collimator jacket 27 to provide strain relief. Acollimating lens 25 is attached as is required for optical properties tothe micro-positioner 24 and electrical leads 26 are passed through thejacket 27 to permit control or electrical connections to themicro-positioner 24.

FIG. 3(a) illustrates a side view of a multiple channel dynamicaligner/collimator with N×M channels wherein micro-positioners of thepresent invention adjust and/or align the optical fibers. As seentherein, the device consists of a conventional buffered optical fiberribbon 31 that has been stripped of the buffer exposing a plurality ofoptical fibers 32. The optical fibers 32 are inserted into a fiber guide33 that aligns the bare optical fibers 32 so they may be inserted intothe N×M micro-positioners 34. The micro-positioners 34 can individuallymove the optical fibers 32 with precision in two dimensions, Y, which isvertically, and X, which is in and out of the plane of the paper, andindividually lock the optical fibers 32 or component positions in placeafter movement. Glass seal 39 may be added to provide a fiber seal.Light exits optical fibers 32 through free space through lens arraypanel 35. The buffered optical fiber ribbon 31, optical fibers 32, andguide 33 are securely coupled either mechanically or with epoxy 38 intothe collimator jacket 37 to provide strain relief. A collimating lensarray panel 35 is attached as is required for optical properties andelectrical control leads 36 are passed through the jacket 37 to permitelectrical connections to the micro-positioner 34.

FIG. 3(b) illustrates a front view of an N×M array of FIG. 3(a). Morespecifically, FIG. 3(b) illustrates an 8×8 optical fiber arrayembodiment of the present invention. As seen therein control leads 36extend from jacket 37. Light from the terminating end of each individualoptical fiber traverses its correlating lens of lens array panel 35.

FIG. 4 shows a multi-optical fiber configuration similar to that of FIG.3, however the embodiment comprises a plurality of collimators arrangedin an array and an array of single lenses. As seen therein, the deviceconsists of a conventional buffered optical fiber ribbon 41 that hasbeen stripped of the buffer exposing a plurality of optical fibers 42.The optical fibers 42 are inserted into optical fiber guide 43 thataligns the bare optical fibers 42. Each micro-positioner 44 of a N×Mmicro-positioner array adjusts and/or aligns an individual lens 45 withprecision in two dimensions Y, which is vertically, and X, which is inand out of the plane of the paper and individually locks each lens 45 inplace after movement. The buffered optical fiber ribbon 41, opticalfibers 42, and optical fiber guide 43 are securely coupled eithermechanically or with epoxy into the collimator jacket 47 to providestrain relief. Each collimating lens 45 is mounted on an individualmicro-positioner 44 and electrical leads 46 are passed through thejacket 47 to permit control or electrical connections to eachmicro-positioner 44 of the N×M micro-positioner array.

FIG. 5 illustrates the electrical operation of a one-dimensionalmicro-positioner 50. As seen therein, when a positive voltage is appliedto the direction terminal 56, the right clamp 53 opens as current flowis determined by diodes 55. If an additional positive voltage is appliedto the axis terminal 57, then heat is dissipated in the expansion bar 51by heating resulting from current flow in expansion bar 51 or by currentflow through resistors (not shown) coupled to expansion bar 51, resultsin the expansion bar 51 expanding to the right since clamp 52 is closed.Reversing the voltage on the direction terminal 56 causes the left clamp52 to open and the right clamp 53 to close. This holds expansion bar 51to the right as the expansion bar cools. Voltage to direction terminal56 is removed and both clamps 52 and 53 are closed locking the bar intoposition. The bar has moved one step in the right direction. Thus, thesequence and polarity of voltage applied to axis terminal 57 anddirectional terminal 56 of FIG. 5, in the manner shown in FIG. 6, willresult in the movement of the expansion bar 51 of FIG. 5 to the right.The sequence and polarity of voltages applied to axis terminal 57 anddirectional terminal 56 of FIG. 5, in the manner shown in FIG. 7 willresult in the movement of expansion bar 51 of FIG. 5 to the left.

Clamps 52 and 53 of FIG. 5 used to hold the expansion bar can also bethermally activated. When no voltage is applied, the clamp, a conductiveband, fits tight over the expansion bar. This clamping function can beachieved with various implementations. When voltage is applied to theclamp, the clamp expands and releases the expansion bar. Each time thevoltage cycles the expansion bar steps in the direction defined by thedirection voltage polarity. The size of the step is proportional to thesquare of the axis voltage applied as seen in Equation 1 below. Thus,the micro-positioner will make large steps for high voltages and smallor fine adjustments for low voltages. This allows for minimum alignmenttimes as well as fine resolution. As can be seen from Equation 1, theconstant of proportionality is a function of material properties andconfiguration. Equation  1-Step  Size$S = {\alpha\quad L\quad\frac{\theta}{R}V^{2}}$S = step  for  each  voltage  pulseα = Coefficient  of  thermal  expansionL = Length  of  actuator  (Clamp  to  Clamp) θ = Thermal  resistanceR = Electrical  resistance V = Applied  Voltage

In operation, the expansion bar must be allowed to heat and cool. Thetime constant for these transisitons is given in Equation 2 below Inpractice the bar will cool faster than equation 2 predicts, sinceequation 2 considers thermal conductivity only when in practice, thermalconvection will also occur. Equation  2-Time  Constants λ = θ  dC_(t)LWTλ = Time  constant C_(t) = Specific  Heat d = DensityW = Width  of  expansion  bar L = Length  of  expansion  barT = Thickness  of  expansion  bar θ = Thermal  Resistance

Equations 1 and 2 predict the step length versus voltage and time. Thus,expansion bar motion may be defined as follows for the heating cycle andfor the cooling cycle as follows: During  heating:$S_{H} = {\alpha\quad{L\left( \frac{V^{2}}{\rho} \right)}\left( \frac{1}{K} \right)\left( {1 - {\mathbb{e}}^{- \frac{t}{\lambda}}} \right)}$During  cooling$S_{C} = {S_{H}\left( {\mathbb{e}}^{- \frac{t}{\lambda}} \right)}$

Where the symbols are as above in Equations 1 and 2 and S_(H) is heatingstep size, S_(C) is cooling step size, K is thermal conductivity and ρis electrical resistivity.

Employing an expansion bar in two dimensions requires two expansion barsbut adds the complication that each expansion bar must have two degreesof freedom. One degree of freedom is needed to accomplish controlledmovement and the second is needed to allow free movement in theorthogonal direction.

FIG. 8(a) is a top view of a first embodiment of the micro-positioner 80of the present invention. As seen therein, micro-positioner 80 iscomprised of the following subassemblies, components and elements:shuttle 81, shuttle springs 82, x-axis expansion bars 83(a) and 83(b),x-axis bond pads 84(a) and 84(b), x-axis clamps 85(a) and 85(b), x-axisexpansion springs 86(a) and 86(b), y-axis expansion bars 87(a) and87(b), y-axis bond pads 88(a) and 88(b), y-axis clamps 89(a) and 89(b),y-axis expansion springs 810(a) and 810(b), movable mount 811, andmovable mount aperature 812. In one embodiment of the present invention,the foregoing components and elements are comprised of semiconductormaterial. The shuttle 81 of micro-positioner 80 is adapted to move inthe X direction. Shuttle 81 is attached to micropositioner 80 with eightshuttle springs 82 and the shuttle 81 is adjusted or aligned in the Xdirection by two expansion subassemblies FIG. 8(b). Within shuttle 81are two expansion subassemblies, one for movement in the positive Ydirection and one for movement in the negative direction. The Xdirection expansion subassembly consists of x-axis expansion bars 83(a)and 83(b), two sets of thermal actuated x-axis clamps 85(a) and 85(b)and two sets of x-axis expansion springs 86(a) and 86(b). The Ydirection expansion subassembly consists of y-axis expansion bars 87(a)and 87(b), two sets of thermal actuated y-axis clamps 89(a) and 89(b)and two sets of y-axis expansion springs 810(a) and 810(b). Associatedwith each expansion assembly are a set of bond pads to which electricalconnections can be made to the expansion bars and clamps. In the Xdirection, these comprise bond pads 84(a) and 84(b) and in the Ydirection these comprise bond pads 88(a) and 88(b). External analog orlogic circuitry (not shown) are coupled to micro-positioner 80 via thesebond pads.

The micro-positioner 80 can be manufactured as a silicon chip and can beimplemented in one or two-dimensional arrays. Alternating the clampingand unclamping of directional clamps as associated expansion bars arepowered by the drive stepping motion.

FIG. 8(b) is an exploded view of x-axis expansion assembly consisting ofsprings 86(b), x-axis clamps 85(b), legs 851(b) of x-axis clamps 85(b),and x-axis expansion bars 83(b) of the micro-positioner 80 of FIG. 8(a).The other x-axis expansion subassembly and the y-axis subassemblies aresubstantively similar to the subassembly of FIG. 8(a), except for theirdirectional orientation. In operation, a voltage differential isintroduced across bond pads 84(a). This causes a current to flow throughleg 851(b) and leg 852(b) of x-axis clamp 85(b). Due to the sizedifference in the two legs, leg 852(b) has more resistance than leg851(b), causing leg 852(b) to heat up more and thus expand. This in turncauses the x-axis clamp 85(b) to bend and open up. This effect ischaracteristic of any homogeneous material such as silicon of which thex-axis clamp 85(b) is made. Pressure between the clamp 85(b) and theouter edge of x-axis expansion bars 83(b) disengage when x-axis clamp85(b) bends outward. Similar effects can be caused by introducingvoltage potentials at the bond pads of the other expansion subassembliesof micro-positioner 80. Referring back to FIG. 8(a), when current flowsthrough x-axis clamp 85(b) it opens while x-axis clamp 85(a), withoutcurrent, is closed. Simultaneously, current can be introduced throughx-axis expansion bars 83(a) to cause them to expand, thus moving theshuttle assembly 81 to the left. Soon thereafter, current flow isstopped through x-axis clamp 85(b) whereby x-axis clamp 85(b) cools andretracts to its original position. Clamp 85(b) applies pressure to theouter edge of x-axis expansion bars 83(b) re-engaging and locking thex-axis expansion bars into place once x-axis clamp 85(b) has cooled.Clamp 85(a) is opened as is claim 85(b) and the current throughexpansion bar 83(a) is stopped. After expansion bar 83(a) cools, currentto clamp 85(b) is removed and the shuttle 81 is locked into place.Similar operation and timing of this procedure on x-axis clamps 85(a),85(b) and x-axis expansion bars 83(b) causes movement of shuttle 81 tothe right. Operation and timing of this procedure on y-axis clamps89(a), and 89(b) and y-axis expansion bars 87(a) and 87(b) causesmovement of movable mount 811 downward. Operation and timing of thisprocedure on y-axis clamp 89(b), 89(a) and y-axis expansion bars 87(b)causes movement of movable mount 811 upward. When a terminated end of amedia is threaded through aperture 812 and secured to movable mount 811,the movement of shuttle 81 and or movable mount 811 moves the terminatedend of the optical fiber.

FIG. 9 is a schematic of the electrical operation of the two-dimensionalmicro-positioner of the present invention. As seen therein, bycontrolling polarity and sequence of input voltages 99 and 90, thedirection and axis of motion are determined. By controlling voltageamplitude of 90, step size is determined and the number of voltage pulsedetermines distance moved. If a positive voltage is applied at 99,current flows through Y-up 91 and X-right 92 to ground 98. In otherwords, current is directed through the up clamps and the right clamps,so those clamps open up. If, then a positive voltage is applied at 90,current flows through the X-axis expansion bar 93 and causes movementalong the X right direction. If a negative voltage is applied at 90,current flows through the Y-axis expansion bar 94 and causes movement inthe Y-up direction. After expansion, the voltage is reversed at 99 sothat the appropriate clamps close or open to prevent movement afterremoval of voltage at 90 and cooling of the expansion bar. When theexpansion bar cools, all voltages are removed to lock the axis in place.Similar operation, with reverse sequence at terminal 99 and negativevoltage applied at terminal 90, will provide motion of the y-axis downand with 90 positive, x-axis movement in the left direction occurs.

Another embodiment of the present invention uses heaters attached to theexpansion bar to cause the adjustment of the micro-positioner. The stepsize is controlled by the thermal expansion, thermal conductance andelectrical resistivity properties of the expansion bar. Application of aheater to the expansion bar increases the types of material that can beused as the expansion bar. For an example, titanium carbide can be usedas it has expansion and thermal conductivity advantages over other typesof materials. Tantalum nitride resistor elements can be used to provideheat. This combination provides similar step size control andsignificantly increases micro-positioner speed.

FIGS. 10 to 13 illustrate the micro-positioner of the present inventionalso implemented using MEMS technology. This implementation illustratedin FIGS. 10 to 13 uses differential expansion thermal actuators that areconventionally known in the art to perform the precision translation,through the scanning mechanism, and the precision clamping, through theclamping mechanism. Specifically, FIG. 10 shows a layout of theMEMS-based clamping X-translation stage. FIG. 11 shows a layout for aMEMS-based clamping Y-translation stage. FIG. 12 shows the X-translationstage mounted to the Y-translation stage to form the assembly for a X-Ytranslation stage. FIG. 13 shows the cross section of the X-Y stageassembly.

Micro-positioner 100 is shown in FIG. 10. As seen in FIG. 10, bycontrollably applying electrical signals through electrical connectionsto the bond pads 101, the direction and magnitude of scan by scanningmechanism 102 can be controlled in steps for gross positioning or insub-step distances for fine positioning. This is accomplished by movingthe scanner bar 103 to engage the gears with the gears on the scanningmechanism, deflecting the scanner bar 103 in the direction of desiredscan, then disengaging the scanner bar 103. Also by controlling theelectrical signal applied to the clamp mechanism 104, the clamp can bereleased for X stage motion and reengaged to hold the X scanningmechanism in a fixed position. The clamp mechanism 104 is used to holdthe translation stage in place whenever it is not being moved by thescanning mechanism 102. The retainers 105 are sleeves that areover-the-edge clamps that restrain the motion of the translatingcomponent in one direction while allowing it to move freely in theother. The retainers 105 are not physically attached to the translationstages or the clamp mechanisms, but there is a small space between theretainers and the translation stage. Thermal actuators 106 performtranslation through scanning mechanism 102 and precision clampingthrough clamp mechanism 104. Voltage is varied on the expansionactuators to set the step size. Motions less than a gear step can bemade. While gears are shown on the scanning mechanism 102 in FIG. 10 asthe means of moving and then locking the scanner bar 103, they may beremoved for finer resolution.

FIG. 11 illustrates a micro-positioner 110 of the present invention thatis adapted as a Y translation stage. As seen therein, movable mountaperture 112 of movable mount 111 is moved in the Y direction byscanning mechanism 113 through the expansion and contraction of thegeared scanner bar 114, opening and closing of clamp mechanism 115 andretainers 116. Thermal actuators described earlier in the discussion ofFIG. 8(b) move the scanner bar. While gears are shown in FIG. 11 as themeans of moving and then locking the movable mount 111, they may beremoved and replaced by friction contacts for finer resolution.

FIG. 12 is a top view of the integrated clamping mechanism 120 for theX-Y precision translation stages of the micro-positioner of the presentinvention. As seen in FIG. 12, the X-translation stage 100 and theY-translation stage 110 are fabricated separately and the X-translationstage is physically attached to the Y-translation stage using standardtechniques such as epoxy bonding, atomic bonding, solder reflow,eutectic bonding, or others. Standard silicon-based MEMS fabricationtechniques may be used for the fabrication among other methods. Forexample, standard silicon-on-silicon and/or multi-level fabrication maybe used to create the multilevel structure. The fiber relief cavity canbe formed using deep reactive ion etching, among other techniques. Othermethods of micro-positioner fabrication such as micro machining and LIGAfabricated parts would also provide a multi-dimensional device that whenproperly electrically activated will step the fiber to the desiredposition.

FIG. 13 is a side view of an integrated clamping mechanism 120 for theX-Y precision translation stages of the micro-positioner of the presentinvention. As seen therein, X stage 100 is mounted or formed on x-stagesubstrate 134, which is mounted on Y stage 110. The terminated end of amedia, such as optical fiber 132, is threaded through fiber reliefcavity 133 of Y stage substrate 131. Retainers 135 hold the variousassemblies and subassemblies of micro-positioner 120 in position. Thestages may be retained by other means, such as springs.

FIG. 14 is a top view of a second embodiment of the micro-positioner 140of the present invention. As seen therein, micro-positioner 140 iscomprised of the following subassemblies, components and elements:pinion actuators 141(a) and 141(b), pinion drives 142(a) and 142(b),pinion release 143(a) and 143(b), axis hold actuator 144(a) and 144(b),x-axis and y-axis interconnection bond pads 145(a) and 145(b), x-axisslides and y-axis slides 146(a) and 146(b), axis setup actuators 147(a)and 147(b), and a movable aperture 148.

The apparatus of FIG. 14 provides for both X and Y motion without usingretention springs as seen in the first embodiment of themicro-positioner. The moving aperture 148 slides and is guided by x-axisslides and y-axis slides 146(a) and 146(b). The pinions 141(a) and141(b), provide motion as follows: at rest all pinion actuators, 142(a),142(b), 143(a), 143(b), 144(a) and 144(b) are in contact with and areclamping movable aperture 148 such that the movable aperture is lockedinto position. When movement is desired, for example, in theX-direction, a voltage is applied to holding actuators 144(a) whichexpand and release the aperture 148. An additional voltage is applied topinion drive actuators 142(a) which expand and push the aperture to theleft. After the movement, voltage is removed from holding actuators144(a) and they contract clamping the aperture. Voltage is then appliedto pinion release actuator 143(a), which expands and releases themovable aperture, whereupon voltage can be removed from the pinion drive142(a), and the pinion 141(a) moves back to its rest position. Voltageis then removed from pinion release 143(a), and the pinion contractsback to clamp the movable aperture. One step is completed. Additionalapplication of the above voltage sequence causes the movable aperture tocontinue stepping to the left. Right movement is similar except thesequence of voltage application is reversed. In operation, the pinrelease 143(a) is actuated moving it from movable aperture 148, thepinion drive 142(a) is actuated moving it to the left, voltage isremoved for the pinion release 143(a) and the pinion clamps movableaperture 148, voltage is applied to the pinion hold 144(a) releasingmovable aperture 148, voltage is removed from the pinion drive andmovable aperture 148 is pulled to the right, voltage is removed from thepinion release 143(a) and movable aperture 148 is in its rest state.Additional application of this voltage sequence causes the movableaperture (148) to move in steps to the right. Movement in they-direction is achieved by performing the operation and timing of thisprocedure on Y-axis actuators 142(b), 143(b), and 144(b), which movesmovable aperture 148 downward or upward.

Prior to using micro-positioner 140, it may need to be set up. The setupis required for devices that are fabricated using chemical etchingprocedures. Machining by etching creates gaps between features. As inthe case for actuators 143(a), 143(b), 144(a), and 144(b), these gapsprevent firm clamping in the rest case with no voltages applied. Theexpansion mechanism 147(a) and 147(b) are provided to achieve setup.Expansion mechanism 147(a) and 147(b) consist of four arms, two wide forlow electrical resistance and two narrow for much greater electricalresistance, all electrically connected such that when voltage is appliedat the corresponding bond pads, current flows through all four arms.Appling voltage to expansion mechanisms 147(a) or 147(b), results in thenarrow arm heating and expanding more than the wide arm and theexpansion mechanism 147(a) or 147(b) bow. When the expansion mechanism147(a) and 147(b) bow, they physically contract and move slides 146(a)and 146(b). Slides 146(a) and 146(b) are then moved to place actuators144(a), 144(b), 143(a), and 143(b) into firm contact with movableaperture 148. Removing the voltage from 147(a) and or 147(b) results inthe assemblies contracting and moving back to their rest position, butsince the assemblies are not physically connected to the slides 146(a)and 146(b), the actuators 144(a), 144(b), 143(a), and 143(b) remain infirm contact.

The micro-positioner 140 can be manufactured as a silicon chip and canbe implemented in one or two dimensions. A sequence of voltage orcurrent pulse applied to the bond pads of the mechanism drives steppingmotion in the desired direction.

FIG. 15 illustrates one use of aligner 151 and aligner 152 of thepresent invention to achieve alignment of light paths through opticalcomponents 153. Optical components 153 are housed in case 154. An insitu dynamic aligner application and embodiment of the present inventionutilizing the micro-positioner 80 of FIG. 8(a), is illustrated whereinaligner 151 is inserted into case 154 at the optical input and aligner152 is inserted into case 154 at the output. Applying voltages at theleads 156 of aligners 151 and 152 adjust the terminated ends of opticalfibers 157 and thus adjust the optical path 155 of a light beam to adesired position.

FIG. 16 is a schematic diagram that illustrates the electrical operationof a two-dimensional micro-positioner 160. The clamp/expansion barexpansion and contraction operation of the X-Y micro-positioner 160 issimilar to that of the one-dimensional micro-positioner 50 of FIG. 5. Asseen in FIG. 16, when a positive voltage is applied to axis terminal161, X movement is enabled and when a negative voltage is applied toaxis terminal 162, Y movement is enabled. When a positive voltage isapplied to direction terminal 162, the X-axis direction is to the rightor the Y-axis direction is up and when a negative voltage is applied todirection terminal 162 the X-axis direction is to the left or the Y-axisdirection is down. FIG. 17 is a logic diagram of the electricalschematic of FIG. 16.

FIGS. 18 and 19 set forth optical performance and maximum fiber forcerequired for an exemplary embodiment of the present invention.

FIG. 18 lists the governing equations relating change in beam pointingangle and lateral displacement as the media, such as an optical fiber,is displaced by a micro-positioner, where b is defined as the fiberdisplacement, d the beam displacement and φ_(o) is the beam-pointingangle. The equations apply for conventional lenses although gradientindex and spherical lenses among others may be used.

The formulas of FIG. 19 represent a media, such as an optical fiber,treated as a cantilever beam. One end of an optical fiber is attachedand held rigid. The other, terminated end is fitted with themicro-positioner of the present invention that positions and adjusts theoptical fiber. That causes a slight arc into the optical fiber, thus acertain amount of force is required to hold it in position. In box 1 ofFIG. 18, W represents the formula for the force required to hold theoptical fiber in position, I is the moment of inertia, a is the lengthof the optical fiber from the point it is in contact with themicro-positioner to the point where it is held or the length to thecantilever beam. Box 2 of FIG. 18 is the formula for I, the moment ofinertia, where r is the radius of the optical fiber. The formulas of box1 and 2 lead to the equation of box 3, which is the equation thatdescribes the forces necessary to hold the optical fiber in positionusing the representative parameters of box 4. As seen in FIG. 18, themicro-positioner must exert a force of approximately 2.0 milli-newton tohold an optical fiber in place.

FIG. 20 is a graph illustrating performance of a VOA, with range ofcontrol as a function of fiber displacement. As seen therein, when anoptical fiber is moved to one side, insertion loss takes place, and thusthe device is acting as an attenuator. In operation, typically there aretwo such devices, thus, there would be twice the attenuationperformance.

FIG. 21(a) is a side view of a lens illustrating light ray outputpointing angles and output beam displacement as the fiber is displacedradially. FIG. 21(b) is a graph illustrating optical control andcollimator performance as a function of fiber displacement. As seentherein, FIG. 21(b) illustrates several optical results of moving anoptical fiber using the present invention. These include a change in thepointing angle, the working distance between the optical fiber and lens,and the offset of the beam at the output of the lens. In FIG. 21(b), theworking distance is shown as a line with boxes. Advantageously, workingdistance changes very little as the optical fiber is displaced. Thepointing angle refers to when the light leaves the lens. It is shown asa line with diamonds on FIG. 21(b). It changes over a range as much asfive degrees of point and angle changes. Beam displacement, shown as aline with circles, advantageously tracks substantially linearly as itchanges up to about 700 microns.

FIGS. 22(a) and 22(b) are graphs illustrating typical mechanicalconstraints on design and manufacturing of the in situ fiber alignerembodiment and application of the present invention. These constraintsapply to typical applications but they may be violated as an applicationmay require.

FIG. 23 is a top view of a further embodiment of the micro-positioner2300 of the present invention shown in one dimension only. As seentherein, micro-positioner 2300 is comprised of the followingsubassemblies, components and elements: shuttle or mounting assembly2301, and shuttle aperature 2302, shuttle spring 2303, scanning bar2304, bond pads 2305, clamps 2306(a), 2306(b), 2306(c) and 2306(d),push/pull arms 2307(a) and 2307(b), and actuators 2308. The foregoingcomponents and elements can be comprised of semiconductor material. Inthe embodiment seen in FIG. 23, shuttle 2301 of micro-positioner 2300 isadapted to move in one direction. As seen therein, shuttle 2301 isattached to micropositioner 2300 with shuttle spring 2303 and shuttle2301 is adjusted or aligned by scanning bar 2304. Shuttle spring 2303 isused for retention of shuttle 2301 in this embodiment. Actuators 2308provide the displacement to (a) release the clamps or (b) move thescanning bar by thermal expansion due to an applied electrical signal.The actuators acting in controlled sequence with the clamps cause thescanning bar to move in the positive or negative direction (along thex-axis). The step drive subassembly consists of two thermal actuatedclamps 2306(a) and 2306(b) and two thermal actuated push/pull arms,2307(a) and 2307(b), mechanically coupled to clamps 2306(a) and 2306(b).The step drive and clamp assembly consists of the step drive assemblyjust described plus clamps 2306(c) and 2306(d). Associated with theclamp and stepping subassembly are corresponding bond pads 2305 to whichelectrical connections can be made to the clamps and push/pull arms.External analog or logic circuitry (not shown) are coupled tomicro-positioner 2300 via these bond pads 2305.

The micro-positioner 2300 can be manufactured as a silicon chip and canbe implemented in one or two-dimensional arrays. Alternating theclamping and unclamping of directional clamps relative to the push/pullactuator pushes or pulls a scanning bar in a stepping motion to changethe position of a shuttle. In this implementation, shuttle spring 2303is used to provide in plane stability to shuttle 2301 and is designed toprovide minimum opposing push force to push/pull arms 2307(a) and2307(b). In another embodiment of the present invention, themicro-positioner 2300 is comprised of all the foregoing components,subassemblies and elements except shuttle spring 2303 is eliminated. Inthis embodiment, scanning bar 2304 is mechanically coupled to shuttle2301. In an exemplary embodiment, the micropositioner can havedimensions of between 1 to 5 mm (1), 1 to 5 mm (w) and 0.1 to 1 mm (h).

FIG. 24 comprises a top view of another embodiment of themicro-positioner 2400 of the present invention designed for x-y motion,said FIG. 24 being provided in subparts (a) and (b) so as to moreclearly delineate the reference numerals. As seen therein,micro-positioner 2400 is comprised of the following subassemblies,components and elements: thermal actuators 2308, shuttle or mountingassembly 2401, shuttle aperture 2402, springs 2403, bond pads 2305,x-axis scanning bar 2404, x-axis clamps 2405(a), 2405(b) and 2405(c),x-axis push/pull arms 2406(a) and 2406(b), x-axis thermal actuators forsetup 2407, y-axis scanning bar 2408, y-axis clamps 2409(a), 2409(b) and2409(c), y-axis push/pull arms 2410(a) and 2410(b) and y-axis thermalactuators for setup 2411. The foregoing components and elements may becomprised of semiconductor material. Shuttle 2401 of micro-positioner2400 is adapted to move in the X direction and/or the Y direction.Shuttle 2401 is attached to micropositioner 2400 with two shuttlesprings 2403 and shuttle 2401 is adjusted or aligned in the X directionby x-axis scanning bar 2404 and in the Y direction by y-axis scanningbar 2408. Shuttle springs 2403 are used for retention and restoringforce to shuttle 2401 in this embodiment. The X direction step drivesubassembly consists of two thermal actuated x-axis clamps 2405(a) and2405(b) and two thermal actuated x-axis push/pull arms, 2406(a) and2406(b), mechanically coupled to x-axis clamps 2405(a) and 2405(b). TheX direction step drive and clamp assembly consists of the X directionstep drive assembly just described plus x-axis clamp 2405(c). The Ydirection step drive subassembly consists of two thermal actuated y-axisclamps 2409(a) and 2409(b) and two thermal actuated y-axis push/pullarms, 2410(a) and 2410(b), mechanically coupled to y-axis clamps 2409(a)and 2409(b). The Y direction step drive and clamp assembly consists ofthe Y direction step drive assembly just described plus y-axis clamp2409(c). In this embodiment, the x-axis thermal actuators 2407 andy-axis thermal actuators 2411 are used to setup the the clamping andstepping capability. The x-axis clamp and stepping subassembly, thex-axis thermal actuators, the y-axis clamp and stepping subassembly andy-axis thermal actuators have corresponding bond pads to whichelectrical connections are made to the thermal actuators, clampactuators and push/pull arm actuators. External analog or logiccircuitry (not shown) are coupled to micro-positioner 2400 via thesebond pads. Alternating the clamping and unclamping of directional clampspushes or pulls a scanning bar in a stepping motion to change theposition of a shuttle depending on the stepping and clamping sequence.In an exemplary embodiment, the micropositioner can be dimensioned of 1to 5 mm (1), 1 to 5 mm (w) and 0.1 to 1 mm (h).

FIG. 25 comprises a top view of another embodiment of themicro-positioner 2500 of the present invention, said FIG. 25 beingprovided in subparts (a), (b) and (c) so as to more clearly delineatethe reference numerals. As seen therein, micro-positioner 2500 iscomprised of the following subassemblies, components and elements:thermal acutators 2308, shuttle or mounting assembly 2501, shuttleaperture 2502, retention springs 2503, bond pads 2305, x-axis right sidescanning bar 2504, x-axis left side scanning bar 2508, x-axis right sideclamps 2505(a), 2505(b) and 2505(c), x-axis left side clamps 2509(a),2509(b) and 2509(c), x-axis right side push/pull arms 2506(a) and2506(b), x-axis left side push/pull arms 2510(a) and 2510(b), x-axisright side lever arms 2507(a) and 2507(b), x-axis left side lever arms2511(a) and 2511(b), y-axis top side scanning bar 2512, y-axis bottomside scanning bar 2516, y-axis top side clamps 2513(a), 2513(b) and2513(c), y-axis bottom side clamps 2517(a), 2517(b) and 2517(c), y-axistop side push/pull arms 2514(a) and 2514(b), y-axis bottom sidepush/pull arms 2518(a) and 2518(b), y-axis top side lever arms 2515(a)and 2515(b), y-axis bottom side lever arms 2519(a) and 2519(b). In oneembodiment of the present invention, the foregoing components andelements are comprised of semiconductor material. Shuttle 2501 ofmicro-positioner 2500 is adapted to move in the X direction and/or the Ydirection. Shuttle 2501 is held in plane and adjusted or aligned in theX direction by x-axis scanning bars 2504 and 2508 and in the Y directionby y-axis scanning bars 2512 and 2516. Shuttle spring 2503 is used forretention in this embodiment. The X direction step drive subassemblyconsists of four thermal actuated x-axis clamps 2505(a), 2505(b),2509(a) and 2509(b), four x-axis push/pull arms, 2506(a), 2506(b),2510(a) and 2510(b) mechanically coupled to x-axis clamps 2505(a) and2505(b) and 2509(a) and 2509(b), and, four thermal actuated lever arms2507(a), 2507(b), 2511(a) and 2511(b) mechanically coupled to x-axispush/pull arms 2506(a), 2506(b), 2510(a) and 2510(b). The X directionstep drive and clamp assembly consists of the X direction step driveassembly just described plus x-axis clamps 2505(c) and 2509(c). The Ydirection step drive subassembly consists of four thermal actuatedy-axis clamps 2513(a), 2513(b), 2517(a) and 2517(b), four y-axispush/pull arms, 2514(a), 2514(b), 2518(a) and 2518(b) mechanicallycoupled to y-axis clamps 2513(a) and 2513(b) and 2517(a) and 2517(b),and, four thermal actuated lever arms 2515(a), 2515(b), 2519(a) and2519(b) mechanically coupled to x-axis push/pull arms 2514(a), 2514(b),2518(a) and 2518(b). The Y direction step drive and clamp assemblyconsists of the Y direction step drive assembly just described plusy-axis clamps 2513(c) and 2517(c). Associated with the x-axis clamp andstepping subassembly and the y-axis clamp and stepping subassembly arecorresponding bond pads to which electrical connections can be made tothe clamp and push/pull arm actuators. External analog or logiccircuitry (not shown) are coupled to micro-positioner 2500 via the bondpads 2305. Alternating the clamping and unclamping of directional clampspushes or pulls a scanning bar in a stepping motion to change theposition of a shuttle. In another embodiment of the present invention,the micro-positioner 2500 is comprised of all the foregoing components,subassemblies and elements except shuttle springs 2503 are reduced innumber from four to one and attached to shuttle 2501 and tomicro-positioner 2500. In an exemplary embodiment, the micropositionerso described can have dimensions of between 1 to 5 mm (1), 1 to 5 mm (w)and 0.1 to 1 mm (h).

Advantages of the present invention include (i) substantial costreduction and improved performance; (ii) during application no humanintervention and no specialized equipment are required. The small formfactor of the present invention allows several devices per semiconductorwafer in the semiconductor embodiment of the present invention. Thepresent invention is remotely configurable, can be utilized in activeand passive network components and meets industry requirements formaintaining alignment during mechanical and thermal stresses.

A variety of components can be manipulated by the micropositionerarrangement. These include lenses, prisms, detectors, diodes, laserdiodes, sensors, antenna elements, rf stubs, valves or nozzles. Theoptical embodiment of the present invention can be used in any devicerequiring an optical interface, such as variable optical attenuators(“VOAs”), demultiplexers, multiplexers, switches, optical amplifiers,filters, transmitters, receivers, modulators and for gain flattening ortilting.

The innovative teachings of the present invention are described withparticular reference to the embodiments disclosed herein. However, itshould be understood and appreciated by those skilled in the art thatthe several embodiments of the apparatus disclosed herein provide onlyexamples of the many advantageous uses and innovative teachings herein.Various non-substantive alterations, modifications and substitutions canbe made to the disclosed apparatus without departing in any way from thespirit and scope of the invention.

1. A micro-positioner, comprising: a mounting assembly; a shuttlemovably located within the mounting assembly; at least one actuatormeans of positioning the shuttle at a specific location within themounting assembly; and at least one actuator means of locking theshuttle in place at a location within the mounting assembly.
 2. Amicro-positioner, comprising: a mounting assembly; a shuttle movablylocated within the mounting assembly; a shuttle spring with a first endand second end; the first end of the shuttle spring coupled to a wall ofthe mounting assembly and the second end of the shuttle spring coupledto a side of the shuttle; the shuttle spring adapted to provide a forcebetween said wall of the mounting assembly and said side of the shuttle;a scanning bar coupled to the side of the shuttle opposite the sidecoupled to the shuttle spring; at least a first actuator set and asecond actuator set; at least a first bond pad set and a second bond padset adapted to providing electrical connections to the at least firstactuator set and the second actuator set; at least a first clamp setcoupled to the at least first actuator set; at least one push/pull armwith a first proximate end and a second proximate end, the firstproximate end coupled to the at least second actuator set and the secondend coupled to the at least first clamp set; the first actuator, whenengaged, operable to cause the first clamp set to release or apply aforce against the sides of the scanning bar; and the second actuatorset, when engaged, operable to push or pull the first clamp setlaterally.
 3. The micro-positioner of claim 2, further comprising theshuttle having a shuttle aperature.
 4. The micro-positioner of claim 2,wherein the first actuator set is adapted to retract the first clamp setwhen an electrical signal is applied across the first bond set.
 5. Themicro-positioner of claim 2, wherein the second actuator set is adaptedto move the push/pull bar when an electrical signal is applied acrossthe second bond set.
 6. The micro-positioner of claim 2, furthercomprising a second clamp set; a third actuator set; the third actutatorset, when engaged, operable to cause the second clamp set to release orapply a force against the sides of the scanning bar.
 7. Themicro-positioner of claim 6, further comprising the third actuator setadapted to retract the second clamp set when an electrical signal isapplied across the first electrical bond set.
 8. The micropositioner ofclaim 2, wherein the components are made of semiconductor material. 9.The micropositioner of claim 2, wherein the actuators are manufacturedof material having a predicable thermal expansion co-efficient.
 10. Themicro-positioner of claim 2, further comprising a circuit adapted toapply electrical signals to the actuators in a controlled sequence. 11.The micro-positioner of claim 2, wherein the first set of clamps, thescanning bar and the push/pull arms are arranged as a step driveassembly.
 12. The micro-positioner of claim 2, further comprising beingmanufactured as a silicon chip.
 13. The micro-positioner of claim 2,further comprising being implemented in a multi-dimensional array.
 14. Amicro-positioner designed for x-y motion, comprising: a mountingassembly; at least a first set of thermal actuators; a shuttle adaptedto move in the x direction and y direction; at least a first set ofshuttle springs; said shuttle movably coupled to the mounting assemblyby such at least first set of shuttle springs; an X direction step drivesubassembly coupled to the shuttle; a Y direction step drive subassemblycoupled to the shuttle; at least a first and second set of bond padscoupled to each of the X direction step drive subassembly and Ydirection step drive subassembly, adapted to provide electrical signalsto each of the X direction step drive subassembly and Y direction stepdrive subassembly; and the shuttle adapted to being adjusted or alignedin the X direction by the the X direction step drive subassembly and Ydirection step drive subassembly.
 15. The micropositioner of claim 14,wherein the shuttle has an aperature.
 16. The micro-positioner designedfor x-y motion of claim 14, wherein the shuttle springs are adapted toprovide a retention and restoring force to the shuttle.
 17. Themicro-positioner designed for x-y motion of claim 14, wherein the Xdirection step drive subassembly further comprises: a first and secondthermal actuated x-axis clamp; a first and second thermal actuatedx-axis push/pull arm mechanically coupled to the first and second x-axisclamp; and an X direction step drive and clamp assembly comprising the Xdirection step drive subassembly and a third x-axis clamp.
 18. Themicro-positioner designed for x-y motion of claim 17, further comprisingan x-axis push/pull arm actuator.
 19. The micro-positioner designed forx-y motion of claim 17, wherein the Y direction step drive subassemblycomprises: a first and second thermal actuated y-axis clamp; a first andsecond thermal actuated y-axis push/pull arm mechanically coupled toy-axis clamps; and a Y direction step drive and clamp assemblycomprising the Y direction step drive subassembly and a third y-axisclamp.
 20. The micro-positioner designed for x-y motion of claim 19,further comprising a y-axis push/pull arm actuator.
 21. Themicro-positioner designed for x-y motion of claim 20, further comprisingx-axis thermal actuators and y-axis thermal actuators adapted to setupthe the clamping and stepping capability.
 22. The micro-positionerdesigned for x-y motion of claim 21, further comprising a plurality ofbond pads coupled to the x-axis clamp and stepping subassembly, thex-axis thermal actuators, the y-axis clamp and stepping subassembly andy-axis thermal actuators to which electrical connections.
 23. Themicro-positioner designed for x-y motion of claim 21, further comprisingexternal analog or logic circuitry adapted to apply signals to the bondpads to control the clamping and unclamping of the directional clampsand the movement of the shuttle.
 24. The micro-positioner designed forx-y motion of claim 14, further being comprised of semiconductormaterial.
 25. A micro-positioner, comprising: a mounting assembly; afirst set of thermal acutators; a shuttle adapted to move in an x-axisor y-axis direction; a set of retention springs used to retain theshuttle in the mounting assembly; a plurality of bond pads; an Xdirection step drive subassembly further comprising an x-axis right sidescanning bar and an x-axis left side scanning bar adapted to hold theshuttle in plane, and align the shuttle in the X direction, a set ofx-axis right side clamps, a set of x-axis left side clamps, a set ofx-axis right side push/pull arms, a set of x-axis left side push/pullarms, a set of x-axis right side lever arms, and a set of x-axis leftside lever arms; and a Y direction step drive subassembly furthercomprising a y-axis top side scanning bar and a y-axis bottom sidescanning bar adapted to hold the shuttle in plane, and align the shuttlein the Y direction, a set of y-axis top side clamps, a set of y-axisbottom side clamps, a set of y-axis top side push/pull arms, a set ofy-axis bottom side push/pull arms, a set of y-axis top side lever arms,a set of y-axis bottom side lever arms.
 26. The micro-positioner ofclaim 25, further comprising a set of thermal actuators coupled to, andadapted to move the set of x-axis clamps, set of y-axis clamps, the setof x-axis push/pull arms, the set of y-axis push/pull arms and set ofx-axis lever arms and y-axis lever arms.
 27. The micro-positioner ofclaim 26, further comprising: an X direction step drive subassemblyfurther comprising four x-axis push/pull arms being mechanically coupledto x-axis clamps and four thermal actuated lever arms mechanicallycoupled to x-axis push/pull arms; the X direction step drive subassemblyand a second set of x-axis clamps further comprising an X direction stepdrive and clamp assembly; a Y direction step drive subassembly fourthermal actuated y-axis clamps, four y-axis push/pull arms mechanicallycoupled to the y-axis clamps and four thermal actuated lever armsmechanically coupled to x-axis push/pull arms; and the Y direction stepdrive subassembly and a second set of y-axis clamps further comprising aY direction step drive and clamp assembly.
 28. The micro-positioner ofclaim 27, further comprising a plurality of bond pads to whichelectrical connections can be made to the clamp and push/pull armactuators.
 29. The micro-positioner of claim 28, further comprisinganalog or logic circuitry adapted to provide electrical signals to thebond pads to clamp and unclamp the directional clamps and push or pullthe scanning bars in a stepping motion to change the position of ashuttle.
 30. A micro-positioner, comprising: a shuttle assembly beingadapted to move directionally; a scanning mechanism; the shuttleassembly being movable by the scanning mechanism; a first and secondactuator; a first clamp controlled by the first actuator; the scanningmechanism being clamped with the first clamp that is controlled by thefirst actuator; a scanning bar that engages the scanning mechanism andimparts motion to it; the scanning bar being adapted to engage thescanning mechanism by the first actuator; the scanning bar being adaptedto move the scanning mechanism by a second actuator; the scanning barbeing mechanically coupled to both the first and second actuators; andthe first and second actuators being controlled separately by appliedelectrical power.
 31. The micro-positioner of claim 30, furthercomprising a MEMS device.
 32. The micro-positioner of claim 30 furthercomprising: a first retainer structure to oppose the clamp force; and asecond retainer structure to oppose the engage force of the scanningbar.
 33. The micro-positioner of claim 30, wherein the first and secondactuators are thermal expansion actuators.
 34. The micro-positioner ofclaim 30, wherein the first and second actuators are piezoelectricelements.
 35. The micro-positioner of claim 30, further comprising amounting assembly being coupled to the shuttle assembly.
 36. Themicro-positioner of claim 30, further comprising the scanning bar havinggear teeth to engage gear teeth on the scanning mechanism.
 37. Themicro-positioner of claim 30, further comprising the scanning bar beingadapted to transfer a moving force from the scanning bar to the scanningmechanism through the friction due to the contact of the two.
 38. Themicro-positioner of claim 30, further comprising the shuttle assemblybeing adapted to move in a single direction.
 39. The micro-positioner ofclaim 30, further comprising two orthogonal scanning mechanisms.
 40. Themicro-positioner of claim 30, further comprising the shuttle assemblybeing adapted to move in two orthogonal directions.
 41. Themicro-positioner of claim 30, wherein the scanning mechanism isconstrained in-plane by a flexible spring.
 42. The micro-positioner ofclaim 30, wherein the scanning mechanism is constrained in-plane by theforce of the first clamp and the scanning bar.
 43. The micro-positionerof claim 30, further comprising a second clamp opposed to the firstclamp.
 44. The micro-positioner of claim 30, further comprising: asecond scanning bar opposed to the first scanning bar.
 45. Themicro-positioner of claim 30, wherein the micro-positioner isimplemented using micro-electro-mechanical systems (MEMS) technology.46. The micro-positioner of claim 30, further comprising the shuttleassembly being adapted for accepting and holding a media.
 47. Themicro-positioner of claim 46, wherein the media comprises a nozzle. 48.The micro-positioner of claim 46, wherein the media comprises a valve.49. The micro-positioner of claim 46, wherein the media comprises anoptical device.
 50. The micro-positioner of claim 49, wherein theoptical device comprises a prism.
 51. The micro-positioner of claim 46,wherein the media comprises a conductive wire.
 52. The micro-positionerof claim 46, wherein the media comprises a fiber.
 53. Themicro-positioner of claim 46, wherein the fiber comprises an opticalfiber.
 54. The micro-positioner of claim 46, wherein the media comprisesan antenna element.
 55. The micro-positioner of claim 54, furthercomprising being operable as an active, adaptive antenna array.
 56. Themicro-positioner of claim 54, wherein the electronic signals positioningthe micro-positioner are responsive to a predetermined RF profile. 57.The micro-positioner of claim 46, wherein the media comprises a lens.58. An apparatus for aligning a media, comprising: a media holder beingadapted to move directionally; a scanning mechanism; the media holderbeing contacted and moved by the scanning mechanism; a first and secondactuator; a first clamp controlled by the first actuator; the scanningmechanism being clamped with the first clamp that is controlled by thefirst actuator; a scanning bar that engages the scanning mechanism andimparts motion to it; the scanning bar being adapted to engage thescanning mechanism by the first actuator; the scanning bar being adaptedto move the scanning mechanism by a second actuator; the scanning barbeing mechanically coupled to both the first and second actuators; andthe first and second actuators being controlled separately by appliedelectrical power.
 59. The apparatus of claim 58, in combination withdevices for tuning electronic circuits.
 60. The apparatus of claim 58,for use in a striplines.
 61. The apparatus of claim 58, for use inpositioning one from the group of sensors and end effectors.
 62. Amicro-positioner comprising: a substrate having a top surface, asubstantially planar bottom surface, and an aperture substantiallycentered through the bottom surface to the top surface; a mountingassembly for accepting and holding a media or component; a shuttleassembly, the shuttle assembly being attached to the mounting assembly;the shuttle assembly being adapted to move directionally in response tocontrol signals; an electronic circuit coupled to the shuttle assembly;the shuttle assembly being adapted to move in response to electronicsignals from the electronic circuit; the shuttle assembly furthercomprising a set of expansion bars springs and clamps for each directionof movement; the set of expansion bars, springs and clamps beingpositioned and retained on the top surface of the substrate; theexpansion bars being manufactured of an expansion material adapted toexpand and retract upon the application of a current directed by theelectronic circuit; the set of springs being positioned between a rigidsurface of the substrate and a side of each of the expansion bars, thesprings being operable to apply a force to the side of the expansionbars; the springs being further operable to provide a flexibleelectrical interconnect, and a stabilization member for out-of-planemotion; the clamps being manufactured of an expansion material adaptedto expand and retract upon the application of a current directed by theelectronic circuit; the clamps being positioned to hold the expansionbars in place when the clamps are in a contracted state, when noelectrical power is applied; the clamps being operable to release theexpansion bars when the clamps are in an expanded state, when electricalpower is applied; the mounting assembly being rigidly attached to theexpansion bars; and the mounting assembly being centered over thesubstrate aperture when the shuttle is in a neutral location.
 63. Themicro-positioner of claim 62, further comprising the shuttle assemblybeing adapted for accepting and holding a media.
 64. Themicro-positioner of claim 63, wherein the media comprises a nozzle. 65.The micro-positioner of claim 63, wherein the media comprises a valve.66. The micro-positioner of claim 63, wherein the media comprises anoptical device.
 67. The micro-positioner of claim 66, wherein theoptical device comprises a prism.
 68. The micro-positioner of claim 63,wherein the media comprises a conductive wire.
 69. The micro-positionerof claim 63, wherein the media comprises a fiber.
 70. Themicro-positioner of claim 69, wherein the fiber comprises an opticalfiber.
 71. The micro-positioner of claim 63, wherein the media comprisesan antenna element.
 72. The micro-positioner of claim 71, furthercomprising being operable as an active, adaptive antenna array.
 73. Themicro-positioner of claim 72, wherein the electronic signals positioningthe micro-positioner are responsive to a predetermined RF profile. 74.The micro-positioner of claim 62, being adapted to have dynamicoperation and multiple cycles.
 75. The micro-positioner of claim 62,further comprising being fabricated on a semiconductor top surface. 76.The micro-positioner of claim 62, further comprising having large stepsand high resolution.